Custom PCB
                                              Process parameters

1-20 layer
Material Type
FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers
Board Thickness
0.21mm to 7.0mm
Copper Thickness
0.5 OZ to 6 oz
Max. Board Size: 580mm×1100mm
Min. Drilled Hole Size: 0.2 mm (8 mil)
Min. Line Width: 4mil (0.1mm)
Min. Line Spacing: 4mil (0.1mm)
Surface Finishing
HASL / HASL lead free, HAL, Chemical tin,
Immersion Silver / Gold, OSP, Gold plating
Solder Mask Color
Green / Yellow / Black / White / Red / Blue
Shape tolerance: ±0.13
Hole tolerance: PTH: ±0.076 NPTH: ±0.05
International Certification Standards
Special Requirements
Buried and blind vias+controlled impedance +BGA
Punching, Routing, V-CUT, Beveling
                  For more special process requirements, please contact us