Can reduce the cost of the circuit board: when the density of the PCB increases beyond the eight-layer board, it will be manufactured with HDII, and its cost will be lower than that of the traditional and complicated lamination process.
Increasing Line Density: Interconnecting Traditional Boards and Parts
HDI facilitates the use of advanced fabrication techniques
It has better electrical performance and better reliability of signal accuracy
thermal properties can be improved
Can improve radio frequency interference/electromagnetic interference/electrostatic discharge (RFI/EMI/ESD)
increase design efficiency
