PCB boards are very different in use scenarios, products, performance, materials, areas, etc., resulting in very large changes in the types of components used by different PCE boards, the thickness of connecting wires, and the wiring density. So. What factors need to be considered in the selection of PCB boards?
1. For general electronic products, use FR4 epoxy glass fiber substrate; for high ambient temperature or flexible circuit boards, use polyimide glass fiber substrate; for high frequency boards. Teflon glass fiber substrates are required; for electronic products with high heat dissipation requirements, metal substrates should be used.
2. Plates with higher glass transition temperature (Tg) should be properly selecte. The Tg value should be higher than the circuit operating temperature.
3. The coefficient of thermal expansion (CTE) of the plate is required to be low.
4. High heat resistance is required for the plate. It is generally required that the PCB can have a heat resistance of 250°C/505.
5. The flatness of the plate is required to be good.
6. In terms of electrical performance, for high-frequency circuit boards, it is required to select materials with high dielectric constant and low dielectric loss, including insulation resistance, withstand voltage strength, and arc resistance to meet product requirements.
The above are the factors that should be considered when choosing PCB boards. I believe that after customers and friends understand, they can be targeted when choosing boards in the future.
