Experts predict that the average annual growth rate of the world's electronic information industry in the next 10 years will be 7.4%. By 2010, the world's electronic information industry market will reach 3.4 trillion US dollars, of which electronic complete machines will be 1.2 trillion US dollars, and communication equipment and computers will account for More than 70% of them amounted to US$0.86 trillion. It can be seen that the huge market for copper clad laminates as an electronic basic material will not only continue to exist, but also continue to develop at a growth rate of 15%. Relevant information released by the Copper Clad Laminate Industry Association shows that in the next five years, in order to adapt to the development trend of high-density BGA technology and semiconductor packaging technology, the proportion of high-performance Chiang-type FR-4 and high-performance resin substrates will increase. .
Copper clad laminate (CCL), as the substrate material in PCB manufacturing, mainly plays the role of interconnection, insulation and support for PCB, and has a great influence on the transmission speed and energy loss of signals in the circuit.
The characteristic impedance has a great influence, so the performance, quality, processability in manufacturing, manufacturing level, manufacturing cost, and long-term reliability and stability of PCB depend to a large extent on the copper plate material.
Copper clad laminate technology and production have gone through more than half a century of development. Now the world's annual output of copper clad laminate has exceeded 300 million square meters.
An important part of the base material. Copper clad laminate manufacturing industry is a sunrise industry. It has broad prospects along with the development of electronic information and communication industries. Its manufacturing technology is a high-tech that intersects, penetrates and promotes each other. The history of the development of electronic information technology shows that copper clad laminate technology is one of the key technologies to promote the rapid development of the electronics industry.
The key task of my country's copper clad laminate (CCL) industry in the future development strategy, specifically in terms of products, should work hard on five types of new PCB substrate materials, that is, through the
The development of five new types of substrate materials and breakthroughs in technology have improved the cutting-edge technology of CCL in my country. The development of these five types of new high-performance CCL products listed below is a key topic that engineers and technicians in my country's copper clad laminate industry should pay attention to in future research and development.
1. Lead-free compatible CCL
At the October 11, 2002 meeting of the European Union, two "European Directives" on environmental protection were passed. They will formally and fully implement the resolution on July 1, 2006. two
The first "European Directive" refers to the "Waste Electrical and Electronic Products Directive" (referred to as WEEE) and the "Restriction on the Use of Specific Hazardous Substances" (referred to as RoHs). Using leaded materials, therefore, developing lead-free copper clad laminates as soon as possible is the best way to deal with these two directives.
2. High performance copper clad laminate
The high-performance copper-clad laminates referred to here include low-dielectric constant (Dk) copper-clad laminates, copper-clad laminates for high-frequency and high-speed PCBs, high-heat-resistant copper-clad laminates, and various substrate materials for laminated multilayer boards.
Materials (resin-coated copper foil, organic resin film constituting the insulating layer of laminated multilayer boards, glass fiber reinforced or other organic fiber reinforced prepregs, etc.). In the next few years (until 2010), in the development of this type of high-performance copper clad laminate, according to the forecast of the development of electronic installation technology in the future, the corresponding performance target value should be achieved.
3. Substrate materials for IC packaging substrates
The development of substrate materials for IC packaging substrates (also known as IC packaging substrates) is a very important topic at present. It is also an urgent need to develop my country's IC packaging and microelectronics technology.
With the development of IC packaging in the direction of high frequency and low power consumption, IC packaging substrates will be improved in important properties such as low dielectric constant, low dielectric loss factor, and high thermal conductivity. An important subject of future research and development is thermal connection technology for substrates - effective thermal coordination and integration of heat dissipation and the like.
In order to ensure the degree of freedom in the design of IC packages and the development of new IC packaging technologies, it is essential to carry out model tests and simulation tests. Both work, for mastering the IC
It is very meaningful to understand and grasp the characteristic requirements of the substrate material for packaging, that is, its electrical performance, heat generation and heat dissipation performance, and reliability. In addition, it should further communicate with the design industry of IC packaging to reach a consensus. Provide the performance of the developed substrate material to the designer of the complete electronic product in time, so that the designer can establish an accurate and advanced data base.
The IC packaging substrate also needs to solve the problem of inconsistent thermal expansion coefficient with the semiconductor chip. Even if it is a build-up multilayer board suitable for micro-circuit making, there is an insulating substrate.
The thermal expansion coefficient of the board is generally too large (generally, the thermal expansion coefficient is 60ppm/C). The thermal expansion coefficient of the substrate reaches about 6ppm, which is close to that of the semiconductor chip, which is indeed a "difficult challenge" for the manufacturing technology of the substrate.
In order to adapt to the development of high speed, the dielectric constant of the substrate should reach 2.0, and the dielectric loss factor can be close to 0.001. To this end, beyond traditional substrate materials and traditional manufacturing processes
The new-generation printed circuit board of the art boundary is predicted to appear in the world around 2005. The technological breakthrough, first of all, is a breakthrough in the use of new substrate materials.
Forecasting the future development of C packaging design and manufacturing technology, there will be stricter requirements for the substrate materials used in it. This is mainly manifested in the following aspects: 1. Corresponding to lead-free solder
High Tg property. 2. Achieve low dielectric loss factor matching characteristic impedance. 3. Low dielectric constant corresponding to high speed (E should be close to 2). 4. Low warpage (improvement of flatness of substrate surface). 5. Low moisture absorption rate. 6. Low coefficient of thermal expansion, making the coefficient of thermal expansion close to 6ppm. 7. The low cost of the lC package carrier board. 8. Low-cost substrate material for built-in components. 9. In order to improve the thermal shock resistance, improve the basic mechanical strength. Substrate material suitable for cycling from high to low temperatures without degrading performance. 10. A green substrate material that achieves low cost and is suitable for high reflow soldering temperature.
4. Copper clad laminates with special functions
The copper-clad laminates with special functions referred to here mainly refer to: metal-based (core) copper-clad laminates, ceramic-based copper-clad laminates, high-dielectric constant boards, and copper-clad laminates (or substrate materials) for embedded passive component multilayer boards. , Optical-electric circuit substrate
