A printed circuit board ((PCB) is a structure used to connect and support electronic components. The PCB has conductive paths through which the different components can be connected throughout the board. These channels are etched from the copper sheet. To ensure that the copper layer Do not conduct signal or current, please laminate it into the substrate.
Types of PCB Lamination Procedures
The following are commonly used PCB lamination processes, depending on the type of PCB used:
Multilayer PCB:
A circuit board made up of various layers is known as a multilayer PCB. These layers can be thin etch or trace layers. In both cases, they are glued together by lamination. For lamination, the inner layers of a PCB are subjected to extremes of temperature (375oF) and pressure (275 to 400 psi). Perform this step when laminating with photoresist. Afterwards, the PCB is allowed to cure at high temperature. Finally, the pressure is slowly released and the laminate is cooled slowly.
Double-sided PCB: Although the manufacturing aspects of double-sided PCBs are different from other types of PCBs, the lamination process is very similar. A photosensitive resist layer is used for laminating PCB boards. As mentioned for multilayer PCBs, the process takes place under extreme temperatures and pressures.
Sequential lamination:
If the PCB contains two or more subsets, the sequential lamination technique is used. A subset of multilayer PCBs is created in a separate process. Thereafter, a dielectric substance is inserted between each pair of subsets. Standard manufacturing procedures are followed after this process.
Teflon (PTFE) microwave laminate:
PTFE microwave laminate is one of the most commonly used laminates for PCB lamination. The reason for this is that it has a consistent dielectric constant, extremely low electrical losses and tight thickness tolerances. These features are ideal for printed circuit boards to be used in applications involving radio frequencies. CTFE (chlorotrifluoroethylene) thermoplastic film is a common material used for PTFE lamination.
