In PCBA processing and SMT solder resist ink is very important. Its main function is to protect the circuit board, prevent the conductor from running and show, prevent the short circuit caused by the influence of moisture and humidity, and prevent the unqualified treatment from the open circuit caused by contact. Wait, it is the guarantee that the PCBA board can be used normally in harsh environments. The following is a brief introduction of poor soldering film design in PCBA packaging processing:
1. Pad through-hole lines. In principle, resistance soldering should be performed for wires between vias connected to pads.
2. The design of resistance welding between pads and the graphic specifications of resistance welding should conform to the design of the distribution of welding ends of specific components: if window resistance welding is used between pads, the distance between pads and pads A short circuit between pads does not occur.
3. The size of the resistance welding diagram of the components is improper, and the design of the resistance welding diagram is too large, which will "shield" each other and lead to open welding, so that the distance between the components is too small.
4. There is no resistance welding film in the hole under the module, and there is no resistance welding hole under the module. After wave soldering, the solder on the hole may affect the reliability of IC soldering, and may also cause defects such as short circuit of components.
The above are the factors that cause poor PCBA solder mask. I hope the above knowledge can help you!
