FPC flexible circuit boards have a wide range of applications. Some circuits and electronic vehicles will be used. Flexible circuit boards are double-sided and single-sided. The production processes of single-sided and double-sided flexible circuit boards are different. The following is the corresponding production process.
FPC double-sided circuit board production process:
Cutting→Drilling→PTH→Electroplating→Pretreatment→Apply dry film→Alignment→Exposure→Development→Graphic electroplating→Remove film→Pretreatment→Apply dry film→Align exposure→Development→Etching→Remove film→Surface treatment → Paste cover film → Press → Curing → Immersion nickel gold → Printing characters → Cutting → Electrical measurement → Die cutting → Final inspection → Packaging → Shipment
FPC single-sided circuit board production process:
Cutting→drilling a dry film→alignment→exposure→developing→etching→removing film→surface treatment→covering film→pressing→curing→surface treatment→immersion nickel gold→printing characters→shearing→electrical measurement→punching Cutting→final inspection→packaging→shipping
The production process of FPC flexible circuit board is roughly as described above by Intellectual Circuit Board Manufacturers. Although there are differences in single-sided and double-sided, the production principle is still the same.
