1. Simple one-time laminated printed circuit board (one-time laminated 6-layer pcb board, laminated structure is (1+4+1)) This type of board is the simplest, that is, the inner multi-layer circuit board has no buried holes and one-time pressing The combination is completed. Although it is a one-time laminate, its manufacture is very similar to the conventional multi-layer circuit board one-time lamination, except that the follow-up is different from the multi-layer circuit board in that multiple processes such as laser drilling blind holes are required. Since there is no buried hole in this laminated structure, in the production, a core board can be made on the 2nd and 3rd layers, and another core board can be made from the 4th and 5th layers, and the outer layer is added with a dielectric layer and copper. The foil is laminated with a dielectric layer in the middle, which is very simple, and the cost is lower than that of conventional primary laminates.
2. Conventional one-time laminated HDI circuit board (one-time laminated HDI circuit board 6-layer PCB board, the stacked structure is (1+4+1)) The structure of this type of board is (1+N+1), (N22, N even number), this structure is the mainstream design of the primary laminate in the industry at present, and the inner multilayer board has buried holes, which require secondary lamination to complete. This type of primary laminate board has buried holes in addition to blind hole circuit boards. If the designer can convert this type of HDI circuit board into a simple primary laminate of the first type above, It is beneficial to both supply and demand sides. Many of our customers have been suggested by us, and it is preferable to change the laminated structure of the second type of conventional primary laminate to a simple primary laminate similar to the first type.
3. Conventional secondary laminated HDI circuit boards (secondary laminated HDI8 laminates, the stacked structure is (1++1+4+1+1)) The structure of this type of board is (1+1+ N+1+1), (N22N even number), this structure is currently the mainstream design of the second lamination in the industry, the inner multi-layer board has buried holes, and it needs three times of lamination to complete. The main reason is that there is no stacked hole design, and the production difficulty is normal. If the buried hole optimization of the (3-6) layer can be changed to the buried hole of the (2-7) layer as mentioned above, one pressing can be reduced, and the optimized process to reduce costs. This type is like the example below.
4. Another conventional secondary laminated HDI printed board (secondary laminated HDI8 laminate, stacked structure is (1+1+4+1+1)) The structure of this type of board (1+ 1+N+1+1),
(N≥2, N even number), although it is a secondary laminate structure, but because the position of the buried hole is not between (3-6) layers, but between (2-7) layers, this design is also It can reduce the lamination once, so that the HDI board that is laminated twice needs 3 lamination processes, which is optimized to 2 lamination processes. And this kind of board has another difficulty in making, there are (1-3) layers of blind holes, which are split into (1-2) layers and (2-3) layers of blind holes to make, it is necessary to divide (2) -3) The inner blind hole of the layer is made by hole filling, that is, the inner blind hole of the secondary layer is made by the hole filling process. Usually, the cost of HDI with the hole filling process is lower than that without the hole filling process. Therefore, in the design process of conventional secondary laminates, it is recommended not to use the stacked hole design as much as possible, and try to convert (1-3) blind holes into staggered (1-2) blind holes and (2-3) Buried (blind) holes. Some experienced designers can adopt this design or optimization to reduce the manufacturing cost of their products.
5. Another unconventional secondary laminated HDI circuit board (secondary laminated HDI 6-layer pcb board, the laminated structure is (1+1+2+1+1)) The structure of this type of board (1 +1+N+1+1), (N≥2, N even number), although it is a secondary laminate structure, but there are also cross-layer blind holes, and the depth capability of blind holes is significantly increased, (1-3 The blind hole depth of the ) layer is double that of the conventional (1-2) layer blind hole. The customer of this design has its own unique requirements and does not allow the (1-3) cross-layer blind hole to be made into a stacked hole type. Blind hole (1-2) (2-3) blind hole, this kind of cross-layer blind hole is not only difficult for laser drilling, but also the subsequent copper sinking (PTH) and electroplating are also one of the difficulties. Generally, it is difficult for PCB manufacturers without a certain technical level to make such boards, and the manufacturing difficulty is obviously much higher than that of conventional secondary laminates. This design is not recommended unless there are special requirements.
6. For the HDI of the secondary laminate of the blind hole stacked hole design, the blind hole is stacked above the buried hole (2-7) layer. (Secondary laminated HDI8-layer pcb board, the stacked structure is (1+1+4+1+1)) The structure of this type of board is (1+1+N+1+1), (N≥2, N even number), this structure is the current design of some secondary laminated boards in the industry, and the buried holes in the inner multilayer board need to be completed by secondary lamination. Mainly there is a stacked hole design, which replaces the cross-layer blind hole design in point 5 above. The main feature of this design is that it needs to stack blind holes above (2-7) buried holes, which increases the difficulty of production. The buried hole design is in (2-7) -7) Layers can reduce one-time lamination, optimize the process and achieve the effect of reducing costs.
7. Secondary laminated HDI with cross-layer blind hole design (secondary laminated HDI8 laminates, stacked structure is (1+1+4+1+1)) The structure of this type of board is (1+1 +N+1+1), (N22, N even number), this structure is a secondary laminated board that is currently difficult to manufacture in the industry. With this design, the inner multi-layer board has buried holes in (3- 6) layer, three pressing is required to complete. The main reason is that there is cross-layer blind hole design, which is difficult to manufacture. It is difficult for HDI PCB manufacturers without certain technical capabilities to make such secondary laminate parts. If this kind of cross-layer blind hole (1-3) layers, optimize the split For (1-2) and (2-3) blind holes, this method of splitting blind holes is not the stacked hole splitting method of points 4 and 6 mentioned above, but staggered blind holes The split method will greatly reduce the production cost and optimize the production process.
8. Optimization of HDI boards with other laminated structures. Three-time laminated printed boards or PCB boards with more than three laminated layers can also be optimized according to the design concept provided above. Complete three-time laminated HDI boards, The entire complete production process requires 4 times of lamination. If the design ideas similar to the above-mentioned one-time laminated panels or secondary laminated panels can be considered, the production process of one-time laminated panels can be completely reduced, thereby improving the plate quality. piece into
