1. What is rigid-flex board?
Rigid-flex board refers to the combination of soft board and hard board. It is a circuit board formed by combining a thin layer of flexible bottom layer and a rigid bottom layer, and then laminating them into a single component. specialty. Due to the mixed use of multiple materials and multiple manufacturing steps, rigid-flex boards take longer to process and cost more to manufacture.
In the PCB proofing of consumer electronics, the use of rigid-flex boards not only maximizes space usage and minimizes weight, but also greatly improves reliability, thereby eliminating the fragility and fragility of solder joints and connection problems Wiring many needs. Rigid-flex boards are also highly impact resistant and can survive high-stress environments.
Rigid-flex boards are extremely versatile and are ideal for military, aviation, and medical equipment, and can also be used in medical equipment such as pacemakers to reduce their space and weight; at the same time, they are also widely used in various A variety of smart devices, test equipment, mobile phones, digital cameras and cars, etc.
2. What is an IC carrier board
IC substrate is a technology developed with the continuous advancement of semiconductor packaging technology.
Like the rigid-flex board, the IC carrier board is a relatively high-end PCB board. It is developed on the basis of HDI board and has the characteristics of high density, high precision, miniaturization and thinning.
IC carrier is also called packaging substrate. In the field of high-end packaging, IC carrier has become an indispensable part of chip packaging. It not only provides support, heat dissipation and protection for the chip, but also provides electronics between the chip and the PCB motherboard. The connection plays the role of "connecting the past and the next"; even passive and active devices can be embedded to achieve certain system functions.
IC substrate products are roughly divided into five categories: memory chip IC substrates, micro-electromechanical system IC substrates, radio frequency module IC substrates, processor chip IC substrates and high-speed communication IC substrates, which are mainly used in mobile smart terminals, service /storage etc.
