1. Powder ceramic filled thermosetting material
processing method:
Similar to epoxy resin/glass woven cloth (FR4), except that the board is relatively brittle and easy to break, and the life of the drill bit and gong cutter will be reduced by 20% when drilling holes and gong boards.
2. PTFE (polytetrafluoroethylene) material
processing method:
1. Cutting: the protective film must be kept to prevent scratches and indentations
2. Drilling:
2.1 Use a new drill bit (standard 130), one piece is the best, the pressure of the presser foot is 40psi2.2 aluminum sheet is used as the cover plate, and then use 1mm melamine backing plate to tighten the PTFE plate
2.3 Use an air gun to blow out the dust in the hole after drilling
2.4 Use the most stable drilling rig, drilling parameters (basically, the smaller the hole, the faster the drilling speed, the smaller the chip load, and the smaller the return speed)
3. Hole L treatment
Plasma treatment or sodium naphthalene activation treatment is beneficial for hole metallization
4.PTH immersion copper
4.1 After micro-etching (the micro-etching rate has been controlled by 20 microinches), pull the plate from the deoiling cylinder at the PTH
4.2 If necessary, pass the second PTH, only need to enter the plate from the expected cylinder
5. Solder mask
5.1 Pre-treatment: use acid to wash the plate, do not use mechanical grinding
5.2 Baking board after pretreatment (90°c, 30min), brush green oil to cure
5.3 Baking plates in three stages: one stage at 8OC, 100°C, and 150°C for 30 minutes each (if oil is found on the surface of the base material, you can rework: wash off the green oil and reactivate it)
6. Gong board
Spread the white paper on the circuit surface of the PTFE board, and clamp it with a FR-4 substrate board or a phenolic bottom board with a thickness of 1.0MM to etch the copper.
