When electronic equipment is working, it will generate heat. Therefore, it is very important to dissipate heat on the PCB circuit board. So, what are the factors that affect the heat dissipation of PCB circuit boards? Please talk to professional PCB engineers to find out:
一. Factors that increase the temperature of the PCB circuit board
The direct cause of the temperature rise of the printed circuit board is due to the existence of circuit power consumption devices, electronic devices have power consumption to varying degrees, and the heating intensity varies with the power consumption.
Two phenomena of temperature rise in printed circuit boards:
(1) Local temperature rise or large area temperature rise;
(2) Short-term temperature rise or long-term temperature rise.
二. When analyzing the factors that affect the heat dissipation of PCB circuit boards, it is generally analyzed from the following aspects:
1. Electrical power consumption:
(1) Analyze power consumption per unit area;
(2) Analyze the distribution of power consumption on the PCB circuit board.
2. The structure of the printed circuit board:
(1) The size of the printed board;
(2) The material of the printed board.
3. Installation method of printed circuit board:
(1) Installation method (such as vertical installation, horizontal installation);
(2) The sealing condition and the distance from the casing.
4. Heat radiation:
(1) The radiation coefficient of the surface of the printed board;
(2) The temperature difference between the printed board and the adjacent surface and their absolute temperature.
5. Heat conduction:
(1) Install the radiator;
(2) Conduction of other installation structures.
6. Thermal convection:
(1) Natural convection;
(2) Forced cooling convection.
Summary: The analysis of the above factors is an effective way to solve the heat dissipation of PCB circuit boards. Often in a product and system, these factors are interrelated and dependent, and should be analyzed according to the actual situation.
