In PCB proofing, ceramic substrates are easier to break than glass fiber boards, and require relatively high technological requirements. There are several very important process links in the process of ceramic substrate PCB proofing, let me share with you below:
1. Drilling
Ceramic substrates generally use laser drilling. Compared with traditional drilling technology, laser drilling technology has high precision, fast speed, high efficiency, and can be drilled in large batches. It is suitable for most hard, The advantages of soft materials and no loss to tools are in line with the high-density interconnection of printed circuit boards and refined development. The ceramic substrate through the laser drilling process has a high bonding force between ceramics and metals, no shedding, blistering, etc., and achieves the effect of growing together. The surface is flat and the roughness is 0.1um ~ 0.3um. In 0.15mm-0.5mm, even can reach 0.06mm.
2. Copper clad
Copper cladding refers to covering the area without wiring on the circuit board with copper foil and connecting it to the ground wire to increase the area of the ground wire, reduce the area of the loop, reduce the voltage drop, and improve power supply efficiency and anti-interference ability. In addition to reducing the impedance of the ground wire, the copper clad has the functions of reducing the cross-sectional area of the loop and enhancing the signal mirror loop. Therefore, the copper clad process plays a very critical role in the ceramic substrate PCB process. Incomplete, truncated mirror loops or incorrectly positioned copper layers often cause new interference and negatively affect the use of the circuit board.
3. Etching
The ceramic substrate also needs to be etched. A layer of lead-tin resist is pre-plated on the circuit pattern, and then the copper in the unprotected non-conductor part is chemically etched away to form a circuit. Etching is divided into inner layer etching and outer layer etching. The inner layer etching uses acid etching, and wet film or dry film is used as a resist; the outer layer etching uses alkaline etching, and tin-lead is used as a resist.
