1. Single-sided PCB process flow:
Blanking and edging→drilling→outer graphics→(gold plating on the whole board)→etching→inspection→silk-screen solder mask→(hot air leveling)→silk-screen characters→shape processing→testing→inspection.
2. Process flow of double-sided pcb board spray tin plate:
Blanking and edging→drilling→immersion copper thickening→outer layer graphics→tin plating, etching and stripping tin→secondary drilling→inspection→silk-screen solder mask→gold-plated plug→hot air leveling→silk-screen characters→shape processing→test→ test
3. Double-sided pcb board nickel-gold plating process:
Blanking and edging→drilling→immersion copper thickening→outer layer graphics→nickel plating, gold removal and etching→secondary drilling→inspection→silk-screen solder mask→silk-screen characters→shape processing→testing→inspection
4. Process flow of nickel-gold plating on multi-layer pcb board:
Cutting and edging, drilling positioning hole→inner layer graphics→inner layer etching→inspection→blackening→lamination→drilling→immersion copper thickening→outer layer graphics→gold plating, film removal and etching→secondary drilling→inspection- Silk screen solder mask → silk screen characters → shape processing → testing → inspection
5. Process flow of multi-layer pcb board immersion nickel gold board:
Cutting and edging→drilling positioning holes→inner layer graphics→inner layer etching→inspection→blackening→lamination→drilling→immersion copper thickening→outer layer graphics→tinning, etching and stripping tin→secondary drilling→inspection →Silk printing solder mask→Immersion nickel gold→Silk printing characters→Shape processing→Testing→Inspection
