PCBA processing includes the production of circuit boards, pcb proofing, smt patch processing, component procurement and other processes. So, what are the selection criteria for PCBA board processing components and substrates?
1. Selection of components
The selection of components should fully consider the needs of the actual area of SMB, choose conventional components as much as possible, and not blindly pursue small-size components, so as not to increase costs. IC devices should pay attention to pin shape and pin spacing; QFP with pin spacing smaller than 0.5mm should be carefully considered, it is better to directly choose BGA packaged devices. In addition, the packaging form of components, PCB solderability, reliability of smt mounting, and temperature tolerance should all be considered.
After selecting the components, a component database must be established, including relevant information such as installation dimensions, pin dimensions, and SMT manufacturers.
2. Selection of base material
The base material should be selecte according to the service conditions of SMB and the mechanical and electrical performance requirements. Determine the number of copper-clad foil surfaces of the base material (single-sided, double-sided or multi-layer) according to the SMB structure; determine the thickness of the base material according to the size of the SMB and the quality of the bearing components per unit area. When selecting SMB substrates, factors such as electrical performance requirements, Tg value (glass transition temperature), CTE, flatness, and price should be considered.
