PCB manufacturing and PCB assembly factories
1.Detailed Specification of PCB Board Manufacturing
| 1 | Layer | 1-30 layer |
| 2 | Material | FR-4,CEM-1,CEM-3,Hight TG,FR4 Halogen Free,FR-1,FR-2,Aluminum |
| 3 | Board thickness | 0.4mm-4mm |
| 4 | Max.finished board side | 500mm*500mm |
| 5 | Min.drilled hole size | 0.25mm |
| 6 | Min.line width | 0.10mm(4mil) |
| 7 | Min.line spaceing | 0.10mm(4mil) |
| 8 | Surface finish/treatment | HASL/HASL lead free,Chemical tin,Chemical Gold,Immersion gold Inmersion Silver/Gold,Osp,Gold Plating |
| 9 | Copper thickness | 1/2OZ 1OZ 2OZ 3OZ |
| 10 | Solder mask color | green/black/white/red/blue/yellow |
| 11 | Inner packing | Vacuum packing,Plastic bag |
| 12 | Outer packing | Standard carton packing |
| 13 | Hole tolerance | PTH:±0.076,NTPH:±0.05 |
| 14 | Certificate | ISO9001,ISO14001,ROHS,CQC |
| 15 | Profiling Punching | Routing,V-CUT,Beveling |
| 16 | Assembly Service | Providing OEM service to all sorts of printed circuit board assembly |
2.Detailed Terms for PCB Assembly
| Technical Requirement | Professional Surface-mounting and Through-hole soldering Technology |
| Various sizes like 1206,0805,0603 components SMT technology | |
| ICT(In Circuit Test),FCT(Functional Circuit Test) technology | |
| PCB Assembly With CE,FCC,Rohs Approval | |
| Nitrogen gas reflow soldering technology for SMT | |
| High Standard SMT&Solder Assembly Line | |
| High density interconnected board placement technology capacity | |
| Quote&Production Requirement | Gerber File or PCB File for Bare PCB Board Fabrication |
| Bom(Bill of Material) for Assembly,PNP(Pick and Place file) and Components Position also needed in assembly | |
| To reduce the quote time, please provide us the full part number for each components,Quantity per board also the quantity for orders. | |
| Testing Guide&Function Testing method to ensure the quality to reach nearly 0% scrap rate | |
| OEM/ODM/EMS Services | PCBA, PCB assembly: SMT & PTH & BGA |
| PCBA and enclosure design | |
| Components sourcing and purchasing | |
| Quick prototyping | |
| Plastic injection molding | |
| Metal sheet stamping | |
| Final assembly | |
| Test: AOI, In-Circuit Test (ICT), Functional Test (FCT) | |
| Custom clearance for material importing and product exporting | |
| Other PCB Assembly Equipments | SMT Machine: SIEMENS SIPLACE D1/D2 / SIEMENS SIPLACE S20/F4 |
| Reflow Oven: FolunGwin FL-RX860 | |
| Wave Soldering Machine: FolunGwin ADS300 | |
| Automated Optical Inspection (AOI): Aleader ALD-H-350B,X-RAY Testing Service | |
| Fully Automatic SMT Stencil Printer: FolunGwin Win-5 |
Factory Manufacture Capability
| layer | 1-20 layer |
| Material type | FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers |
| Board thickness | 0.21mm to 7.0mm |
| Copper thickness | 0.5 OZ to 6 oz |
| Size | Max. Board Size: 580mm×1100mm |
| Min. Drilled Hole Size: 0.2 mm (8 mil) | |
| Min. Line Width: 4mil (0.1mm) | |
| Min. Line Spacing: 4mil (0.1mm) | |
| Surface finishing | HASL / HASL lead free, HAL, Chemical tin, Immersion Silver/Gold, OSP, Gold plating |
| Solder Mask Color | Green/Yellow/Black/White/Red/Blue |
| Tolerance | Shape tolerance: ±0.13 |
| Hole tolerance: PTH: ±0.076 NPTH: ±0.05 | |
| Certificate | UL, ISO 9001, ISO 14001 |
| Special requirements | Buried and blind vias+controlled impedance +BGA |
| Profiling | Punching, Routing, V-CUT, Beveling |
Shenzhen Senyan Circuit Co., Ltd.
Shenzhen SenYan Co.,Ltd. is a professional PCB company that has single-sided, double-sided and multilayer PCBs. And we also specialize in manufacturing SMT,DIP and other special requirment PCBs,such as high precision half orifice circuit boards, impedance circuit boards and buried blind hole circuit boards.Meanwhile we can copy any PCB/PCBA according to our customer’s sample board...
If you have projects that need PCB, please don't hesitate to contact us, we will reply and prepare quote for you as soon as possible.
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Layer
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1-20 layer
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Material Type
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FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers
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Board Thickness
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0.21mm to 7.0mm
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Copper Thickness
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0.5 OZ to 6 oz
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Size(Custom)
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Max. Board Size: 580mm×1100mm
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Min. Drilled Hole Size: 0.2 mm (8 mil)
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Min. Line Width: 4mil (0.1mm)
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Min. Line Spacing: 4mil (0.1mm)
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Surface Finishing
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HASL / HASL lead free, HAL, Chemical tin,
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Immersion Silver / Gold, OSP, Gold plating
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Solder Mask Color
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Green / Yellow / Black / White / Red / Blue
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Tolerance
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Shape tolerance: ±0.13
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Hole tolerance: PTH: ±0.076 NPTH: ±0.05
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Certificate
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International Certification Standards
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Special Requirements
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Buried and blind vias+controlled impedance +BGA
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Profiling
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Punching, Routing, V-CUT, Beveling
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