Slicing analysis technology is one of the most common and important analysis methods in the PCB industry. It is like a doctor looking at X-ray films. It can accurately determine the quality of the product, analyze the cause of the problem, provide a basis for the solution and evaluate the process. improvement of. Slicing analysis is mainly used to check the copper thickness, number of layers, stacked structure, via hole diameter, hole copper thickness, hole wall roughness, etc. inside the PCB.
PCB slices can be divided into vertical slices and horizontal slices:
1. Vertical section: Cut along the direction perpendicular to the board surface to observe the section condition, usually used to observe the quality of the hole after copper plating, the laminated structure and the condition of the internal bonding surface. Vertical slices are the most commonly used method for slice analysis.
2. Horizontal slicing: that is, grinding down layer by layer along the superimposition direction of the boards, used to observe the condition of each layer, usually used to assist vertical slicing in analyzing and judging quality abnormalities, such as internal short or internal opening abnormalities, etc. .
Slicing production generally includes a series of means and steps such as sampling, inlaying, slicing, polishing, corrosion, and observation to obtain a smooth PCB cross-sectional structure. Then analyze the microscopic details of the slice through a metallographic microscope. Only by making a correct interpretation of the slice can a correct analysis be made and effective solutions be given. Therefore, the quality of slices is particularly important, and slices with poor quality will bring serious misleading and misjudgment to the analysis of failure problems. As the most important analysis equipment, the metallographic microscope has a magnification ranging from 50 to 1000 times, and the measurement accuracy deviation is within 1 μm.
