Aluminum substrate is a metal-based copper clad laminate with good heat dissipation function. Let us understand the classification of PCB aluminum substrates.
1. Flexible aluminum PCB
One of the latest developments in IMS materials is flexible dielectrics. These materials provide excellent electrical insulation, flexibility and thermal conductivity. When applied to flexible aluminum materials, products can be formed to achieve various shapes and angles, which can eliminate expensive fixtures, cables and connectors.
2. Mixed aluminum-aluminum PCB
Most commonly a 2- or 4-layer subassembly made of traditional FR-4, bonding this layer to an aluminum substrate with a thermal dielectric can help dissipate heat, increase rigidity and act as a shield.
3. multi-layer aluminum PCB
In the high-performance power supply market, multilayer IMSPCBs are made of multiple layers of thermally conductive dielectrics. These structures have one or more layers of circuitry embedded in a dielectric, with blind vias serving as thermal vias or signal paths.
4. Through-hole aluminum PCB
In the most complex structures, a layer of aluminum can form the "core" of a multilayer thermal structure. Aluminum is pre-plated and filled with dielectric prior to lamination. Thermal material or subassemblies can be laminated to both sides of the aluminum using a thermal adhesive material. Once laminated, the finished assembly resembles a traditional multilayer aluminum substrate by drilling holes. Plated through-holes go through gaps in the aluminum to maintain electrical isolation.
