The first thing I want to introduce to you is PCB copper clad laminate. In Shenzhen circuit board industry, copper clad laminate is the most basic material for producing PCB circuit boards, and it is also the primary purchase object of major circuit board factories.
一、PCB Copper Clad Laminate (CCL)
1. Classification
Rigid CCL is divided into: paper substrate, ring fiber cloth substrate, composite material substrate, special type
A. Paper substrate
B. Ring fiber cloth substrate
C. Special type
2. Substrate material
(1) Mainly used in circuit board factory production
a. Electronic-grade alkali-free glass cloth is usually used, and the commonly used models are 1080, 2116, 7826, etc.
b. Impregnated fiber paper
c. Copper foil
Classification according to the method of making copper foil: rolled copper foil and electrolytic copper foil
The standard thickness of copper foil are: 18um (HOZ), 35um (1OZ) and 7Oum (2OZ)
In addition, 12um (1/30Z) and high-thickness copper foils have been put on the market. In the circuit board industry, these are the necessary data and materials for PCB circuit board production. At the same time, the Shenzhen circuit board industry especially controls data in this regard.
FR-4 fiberglass board is generally divided into:
FR-4 rigid circuit board, common board thickness 0.8-3.2mm;
FR-4 thin circuit board, the common board thickness is less than 0.78mm.
The general technical indicators of FR-4 glass fiber circuit board materials are:
Bending strength, peel strength, thermal shock performance, flame retardancy, volume resistivity, surface resistance, dielectric constant, dielectric loss tangent, glass transition temperature Tg, dimensional stability, maximum service temperature, warpage, etc.
3. Prepreg (Prepreg or PP)
PP is a prepreg material composed of resin and reinforcing materials. Where the resin is a "B-staged" resin in a semi-cured state. PP commonly used in circuit board factories generally use FR-4 prepreg.
4. Composite base CCL
