The process flow of resin plug holes has been widely used in the PCB circuit board industry in recent years, especially in some high-layer, high-precision PCB multilayer circuit boards with thicker products. It is hoped that the use of resin plug holes will solve a series of problems that cannot be solved by using green oil plug holes or press-fit resin. However, because of the characteristics of the resin used in this circuit board process, many difficulties need to be overcome in the production of the circuit board in order to obtain a good quality of the resin plugged product. So do you know what the process of resin plugging is?
Circuit board outer layer without resin plug hole process
(1) The production of the outer layer meets the requirements of the negative film, and the thickness-to-diameter ratio of the through hole is ≤6:1.
The conditions that need to be met for the PCB circuit board negative film are: the line width/line gap is large enough, the maximum PTH hole is smaller than the maximum sealing capacity of the dry film, and the circuit board thickness is smaller than the maximum board thickness required by the negative film. And there are no boards with special requirements; boards with special processes include: partial electro-gold boards, electroplated nickel-gold boards, half-hole boards, printed plug boards, ringless PTH holes, boards with PTH slots, etc.
Production of the inner layer of the circuit board→pressing→browning→laser drilling→debrowning→drilling of the outer layer→sinking copper→hole filling and electroplating of the whole board→slicing analysis→outer layer graphics→outer layer acid etching→outer layer AOI A follow-up normal process.
(2) The production of the outer layer meets the requirements of the negative film, and the thickness-to-diameter ratio of the through hole is >6:1.
Since the thickness-to-diameter ratio of the through-holes is >6:1, the copper thickness of the through-holes cannot be met by using the full-board hole-filling electroplating. Plating to the required thickness, the specific process is as follows:
Inner layer production→pressing→browning→laser drilling→debrowning→outer layer drilling→copper sinking→full board hole filling electroplating→full board electroplating→slicing analysis→outer layer graphics→outer layer acid etching→follow-up Normal Process
(3) The outer layer does not meet the requirements of the negative film, the line width/line gap is ≥a, and the thickness-to-diameter ratio of the through hole in the outer layer is ≤6:1.
Production of the inner layer of the circuit board→pressing→browning→laser drilling→debrowning→drilling of the outer layer→sinking copper→hole filling electroplating of the whole board→slicing analysis→outer layer graphics→graphic plating→outer layer alkaline etching → Outer layer AOI → follow-up normal process.
(4) The outer layer does not meet the requirements of the negative film, and the line width/line gap is 6:1.
Inner layer production→pressing→browning→laser drilling→debrowning→immersion copper→full board hole filling electroplating→section analysis→copper reduction→outer layer drilling→immersion copper (2)→full board electroplating→outside Layer graphics-pattern electroplating→outer layer alkaline etching→outer layer AOI→following normal process.
