一. Powder ceramic filled thermosetting material
processing method:
The processing flow is similar to that of epoxy resin/glass woven cloth (FR4), except that the board is relatively brittle and easy to break, and the life of the drill bit and gong cutter will be reduced by 20% when drilling holes and gong boards.
二. PTFE (polytetrafluoroethylene) material
processing method:
1. Cutting: the protective film must be kept to prevent scratches and indentations
2. Drilling:
2.1 Use a new drill bit (standard 130), one piece - one stack is the best, and the pressure of the presser foot is 40psi
2.2 The aluminum sheet is used as the cover plate, and then the PTFE plate is tightened with a 1mm melamine backing plate
2.3 Use an air gun to blow out the dust in the hole after drilling
2.4 Use the most stable drilling rig, drilling parameters (basically, the smaller the hole, the faster the drilling speed, the smaller the chip load, and the smaller the return speed)
3. Hole treatment
Plasma treatment or sodium naphthalene activation treatment is beneficial for hole metallization
4.PTH immersion copper
4.1 After micro-etching (the micro-etching rate has been controlled by 20 microinches), pull the plate from the deoiling cylinder at the PTH
4.2 If necessary, go through the second PTH, just start to enter the plate from the expected cylinder
5. Solder mask
5.1 Pre-treatment: use acid to wash the plate, do not use mechanical grinding
5.2 Pre-treatment and post-baking board (90C, 30min), brush with green oil to cure
5.3 Baking plates in three stages: one stage at 80°C, 100°C, and 150°C for 30 minutes each (if oil is found on the surface of the base material, it can be reworked: wash off the green oil and reactivate it)
6. Gong board
Spread the white paper on the circuit surface of the PTFE board, and clamp it with a FR-4 substrate board or a phenolic bottom board with a thickness of 1.0MM to etch the copper.
