What are the main characteristics of immersion gold circuit boards

1. Because the crystal structures formed by immersion gold and gold plating are different, immersion gold will be more golden yellow than gold plating, and customers are more satisfied.
2. The project will not affect the spacing when making compensation.
3. The flatness and standby life of immersion gold circuit boards are as good as those of gold-plated boards.
4. Because immersion gold has a denser crystal structure than gold plating, it is not easy to produce oxidation.
5. Because the immersion gold circuit board only has nickel-gold on the pad, it will not produce gold wire to cause micro-short.
6. Since the immersion gold circuit board only has nickel-gold on the pad, the combination of the solder mask on the circuit and the copper layer is stronger.

7. Because the immersion gold circuit board only has nickel gold on the pad, the signal transmission in the skin effect will not affect the signal in the copper layer.
8. Because the crystal structures formed by immersion gold and gold plating are different, immersion gold is easier to weld than gold plating, and will not cause poor welding and cause customer complaints.
9. Because the crystal structures formed by immersion gold and gold plating are different, the stress of the immersion gold plate is easier to control, and for products with bonding, it is more conducive to bonding processing. At the same time, it is precisely because immersion gold is softer than gold plating, so the gold fingers of the immersion gold circuit board are not wear-resistant.