The main reasons for the failure of PCBA processing solder joints:
1. Bad component pins: plating, pollution, oxidation, coplanarity.
2. Bad PCB pads: plating, pollution, oxidation, warping.
3. Solder quality defects: composition, impurities are not up to standard, oxidation.
4. Flux quality defects: low flux, high corrosion, low SIR.
5. Defects in process parameter control: design, control, equipment.
6. Defects in other auxiliary materials: adhesives, cleaning agents.
Method for increasing the stability of PCBA solder joints:
The stability experiment of PCBA solder joint includes stability experiment and analysis. On the one hand, its purpose is to evaluate and identify the stability level of PCBA integrated circuit devices, and provide parameters for the stability design of the whole machine.
On the other hand, it is necessary to improve the stability of solder joints during PCBA processing. This requires an analysis of the failed product to find out the failure mode and analyze the cause of the failure. The purpose is to correct and improve the design process, structural parameters, welding process, and improve the yield of PCBA processing. The failure mode of PCBA solder joints is the basis for predicting its cycle life and establishing its mathematical model.
The above are the main reasons for the failure of PCBA solder joints, I hope it can provide you with some references!
