Copper substrate is the most expensive kind of metal substrate, and its thermal conductivity is much better than that of aluminum substrate. It is suitable for high-frequency circuits; it is divided into immersion gold copper substrate, silver-plated copper substrate, tin-sprayed copper substrate, anti-oxidation copper substrate, etc.; The circuit layer requires a large current-carrying capacity, so thicker copper foil is used, and the thickness is generally 35um~280um. So, what are the manufacturing process of copper substrate? Let’s understand together—below:
1. Cutting: Cut the copper substrate raw material into the size required for production.
2. Drilling: Carry out positioning drilling on the copper substrate plate to provide assistance for subsequent processing.
3. Circuit imaging: present the required part of the circuit on the copper substrate sheet.
4. Etching: After the circuit is imaged, the required part is retained, and the rest of the unnecessary part is etched away.
5. Silk screen solder resistance: prevent non-soldering points from being contaminated with solder, and prevent tin from entering and causing short circuits. The solder mask is particularly important when performing wave soldering, which can effectively prevent moisture and protect circuits.
6. Silk screen characters: for marking.
7. Surface treatment: to protect the surface of the copper substrate.
8. CNC: Perform CNC operations on the entire board.
9. Withstanding voltage test: test whether the circuit works normally.
10. Packaging and shipment: The copper substrate confirms that the packaging is complete and beautiful, and the quantity is correct.
