When drilling PCB holes, there are often some defects, which are divided into drilling defects and in-hole defects. These defects directly affect the reliability of hole metallization quality. So, what factors affect the quality of PCB board drilling?
1. The printed circuit board is composed of resin, glass fiber cloth and copper foil, and the material is complex. There are many factors that affect the drilling process. A little carelessness in the processing process may directly affect the quality of the hole, and in severe cases it will cause scrapping. Therefore, if an abnormality is found in the over-drilling, it is necessary to analyze the problem in time, put forward corresponding technological countermeasures and correct it in time, so as to produce low-cost, high-quality printed boards.
2. The quality of drilling is related to the structure and characteristics of the base material, the performance of the equipment, the working environment, the quality of the drill bit and the cutting process conditions and other factors. The specific conditions of these influencing factors can be analyzed to find out the exact influencing factors so as to take targeted improvement measures.
3. Some factors affecting the drilling quality are mutually restrictive, and sometimes several factors work at the same time to affect the quality. For example, substrates with a higher glass transition temperature (Tg) and substrates with a lower glass transition temperature have different drilling conditions due to the different brittleness of the substrates. The drilling conditions for substrates with a higher glass transition temperature The feed rate is lower. Therefore, to formulate the correct drilling program and select the appropriate drilling process method before drilling, the structural characteristics and physical and chemical properties of the substrate should be well understood.
